Non-Woven Brush for PCB oxide removing

Description:

The Non-woven brush roller is characterized by fine grinding and uniform surface roughness, which can significantly improve the adhesion of photosensitive film and solder resistance grinding, especially suitable for the manufacture of PCB with line width/line distance ≤100um and copper foil thickness ≤ 35um. It has excellent performance in the fields of burr removal after drilling, photosensitive film pretreatment and solder resistance (anti-oxidation) pretreatment. In particular, the introduction of the solder pre-treatment process has been shown to increase the yield or reduce short circuits, open circuits and electrical testing NG10%-15% or more, which is further verified by industry friends who are particularly concerned about this issue.

Other brushes : Nylon brush, Non-woven brush, Pumice brush

Application on PCB process

Copper particle removal after electroplating;
Grinding after drilling;
Plug hole ink removal grinding;
(HDI) buried hole brush grinding;
BGA overflow removal;
Removal and grinding of residual glue after pressing;
Steel plate, aluminum plate grinding and polishing;
Anti-welding green paint pretreatment;
Remove the raw edge after the hole;
Grinding treatment before coating.